13 years of diverse experience in Hardware design
and engineering, specializing in baseband; RF; battery and energy management; EMC; Chipsets; Set-Top-Box and Smart Things. Huipeng also has many years of experience leading Hardware Architecture design; concept prototyping; and engineering management. He has four international invention patents. Before Huipeng joined IngDan, he held a number of senior management and Hardware Architect positions in international companies, including Chief Hardware Architect and Project Manager at Microsoft (2014 - 2016); Senior Engineering Manager and Principal Hardware Engineer at Nokia (2011 - 2014); Technical Marketing and Hardware FAE Manager at Siano Mobile Silicon (2008-2010); Hardware Team Leader at Thomson (2007 - 2008); and Hardware Manager at Siemens/Benq Mobile (2004 - 2006).
Huipeng obtained his B.E from Central South University, and his M.E. from the China Academy of Telecom Technology.